Abstract
A novel gate process utilising SiO2 to cover the recess sidewall on the drain side of a p-GaN/AlGaN/GaN high electron mobility transistor is presented. Improvements in breakdown voltage and output power are demonstrated with no degradation in small-signal performance.
Original language | English |
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Pages (from-to) | 1419-1420 |
Journal | Electronics Letters |
Volume | 39 |
Issue number | 19 |
DOIs | |
Publication status | Published - 2003 |