Three-dimensional exponentially fitted conforming tetrahedral finite elements for the semiconductor continuity equations

L. Angermann, Song Wang

    Research output: Contribution to journalArticlepeer-review

    17 Citations (Scopus)

    Abstract

    This paper presents and analyzes an exponentially fitted tetrahedral finite element method for the decoupled continuity equations in the drift-diffusion model of semiconductor devices. This finite element method is based on a set of piecewise exponential basis functions constructed on a tetrahedral mesh. The method is shown to be stable and can be regarded as an extension to three dimensions of the well-known Scharfetter-Gummel method. Error estimates for the approximate solution and its associated flux density are given. These h-order error bounds depend on some first-order seminorms of the exact solution, the exact flux density and the coefficient function of the convection terms. A method is also proposed for the evaluation of terminal currents and it is shown that the computed tem-tinal currents are convergent and conservative. (C) 2003 IMACS. Published by Elsevier Science B.V. All fights reserved.
    Original languageEnglish
    Pages (from-to)19-43
    JournalApplied Numerical Mathematics
    Volume46
    Issue number1
    DOIs
    Publication statusPublished - 2003

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