The effect of F/CF2+CH ratio and Si and Si02 etching using CF4 / CH4 inductively coupled plasmas

F. Jiang; Adrian Keating; Mariusz Martyniuk; John Dell

The effect of F/CF₂+CH ratio and Si and Si0₂ etching using CF₄ / CH₄ inductively coupled plasmas

F. Jiang, Adrian Keating, Mariusz Martyniuk, John Dell

Research output: Chapter in Book/Conference paper › Conference paper

Original language	English
Title of host publication	APCOT 2010 The 5th Asia-Pacific Conference on Transducers and Micro-Nano Technology
Editors	John Dell, Wojtek Wlodarski, Adrian Keating, Mariusz Martyniuk
Place of Publication	Perth, Western Australia
Publisher	The University of Western Australia
Pages	229
Volume	1
Edition	Perth, Western Australia
ISBN (Print)	9781740522076
Publication status	Published - 2010
Event	The effect of F/CF₂+CH ratio and Si and Si0₂ etching using CF₄ / CH₄ inductively coupled plasmas - Duration: 1 Jan 2010 → …

Conference

Conference	The effect of F/CF₂+CH ratio and Si and Si0₂ etching using CF₄ / CH₄ inductively coupled plasmas
Period	1/01/10 → …

Cite this

Jiang, F., Keating, A., Martyniuk, M., & Dell, J. (2010). The effect of F/CF₂+CH ratio and Si and Si0₂ etching using CF₄ / CH₄ inductively coupled plasmas. In J. Dell, W. Wlodarski, A. Keating, & M. Martyniuk (Eds.), APCOT 2010 The 5th Asia-Pacific Conference on Transducers and Micro-Nano Technology (Perth, Western Australia ed., Vol. 1, pp. 229). The University of Western Australia.

Jiang, F. ; Keating, Adrian ; Martyniuk, Mariusz et al. / The effect of F/CF₂+CH ratio and Si and Si0₂ etching using CF₄ / CH₄ inductively coupled plasmas. APCOT 2010 The 5th Asia-Pacific Conference on Transducers and Micro-Nano Technology. editor / John Dell ; Wojtek Wlodarski ; Adrian Keating ; Mariusz Martyniuk. Vol. 1 Perth, Western Australia. ed. Perth, Western Australia : The University of Western Australia, 2010. pp. 229

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title = "The effect of F/CF2+CH ratio and Si and Si02 etching using CF4 / CH4 inductively coupled plasmas",

author = "F. Jiang and Adrian Keating and Mariusz Martyniuk and John Dell",

year = "2010",

language = "English",

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pages = "229",

editor = "John Dell and Wojtek Wlodarski and Adrian Keating and Mariusz Martyniuk",

booktitle = "APCOT 2010 The 5th Asia-Pacific Conference on Transducers and Micro-Nano Technology",

publisher = "The University of Western Australia",

address = "Australia",

edition = "Perth, Western Australia",

note = "The effect of F/CF2+CH ratio and Si and Si02 etching using CF4 / CH4 inductively coupled plasmas ; Conference date: 01-01-2010",

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Jiang, F, Keating, A , Martyniuk, M & Dell, J 2010, The effect of F/CF₂+CH ratio and Si and Si0₂ etching using CF₄ / CH₄ inductively coupled plasmas. in J Dell, W Wlodarski, A Keating & M Martyniuk (eds), APCOT 2010 The 5th Asia-Pacific Conference on Transducers and Micro-Nano Technology. Perth, Western Australia edn, vol. 1, The University of Western Australia, Perth, Western Australia, pp. 229, The effect of F/CF₂+CH ratio and Si and Si0₂ etching using CF₄ / CH₄ inductively coupled plasmas, 1/01/10.

The effect of F/CF₂+CH ratio and Si and Si0₂ etching using CF₄ / CH₄ inductively coupled plasmas. / Jiang, F.; Keating, Adrian ; Martyniuk, Mariusz et al.
APCOT 2010 The 5th Asia-Pacific Conference on Transducers and Micro-Nano Technology. ed. / John Dell; Wojtek Wlodarski; Adrian Keating; Mariusz Martyniuk. Vol. 1 Perth, Western Australia. ed. Perth, Western Australia: The University of Western Australia, 2010. p. 229.

Research output: Chapter in Book/Conference paper › Conference paper

TY - GEN

T1 - The effect of F/CF2+CH ratio and Si and Si02 etching using CF4 / CH4 inductively coupled plasmas

AU - Jiang, F.

AU - Keating, Adrian

AU - Martyniuk, Mariusz

AU - Dell, John

PY - 2010

Y1 - 2010

M3 - Conference paper

SN - 9781740522076

VL - 1

SP - 229

BT - APCOT 2010 The 5th Asia-Pacific Conference on Transducers and Micro-Nano Technology

A2 - Dell, John

A2 - Wlodarski, Wojtek

A2 - Keating, Adrian

A2 - Martyniuk, Mariusz

PB - The University of Western Australia

CY - Perth, Western Australia

T2 - The effect of F/CF2+CH ratio and Si and Si02 etching using CF4 / CH4 inductively coupled plasmas

Y2 - 1 January 2010

ER -

Jiang F, Keating A , Martyniuk M , Dell J. The effect of F/CF₂+CH ratio and Si and Si0₂ etching using CF₄ / CH₄ inductively coupled plasmas. In Dell J, Wlodarski W, Keating A, Martyniuk M, editors, APCOT 2010 The 5th Asia-Pacific Conference on Transducers and Micro-Nano Technology. Perth, Western Australia ed. Vol. 1. Perth, Western Australia: The University of Western Australia. 2010. p. 229