The effect of F/CF2+CH ratio and Si and Si02 etching using CF4 / CH4 inductively coupled plasmas

Research output: Chapter in Book/Conference paperConference paper

Original languageEnglish
Title of host publicationAPCOT 2010 The 5th Asia-Pacific Conference on Transducers and Micro-Nano Technology
EditorsJohn Dell, Wojtek Wlodarski, Adrian Keating, Mariusz Martyniuk
Place of PublicationPerth, Western Australia
PublisherThe University of Western Australia
Pages229
Volume1
EditionPerth, Western Australia
ISBN (Print)9781740522076
Publication statusPublished - 2010
EventThe effect of F/CF2+CH ratio and Si and Si02 etching using CF4 / CH4 inductively coupled plasmas -
Duration: 1 Jan 2010 → …

Conference

ConferenceThe effect of F/CF2+CH ratio and Si and Si02 etching using CF4 / CH4 inductively coupled plasmas
Period1/01/10 → …

Cite this

Jiang, F., Keating, A., Martyniuk, M., & Dell, J. (2010). The effect of F/CF2+CH ratio and Si and Si02 etching using CF4 / CH4 inductively coupled plasmas. In J. Dell, W. Wlodarski, A. Keating, & M. Martyniuk (Eds.), APCOT 2010 The 5th Asia-Pacific Conference on Transducers and Micro-Nano Technology (Perth, Western Australia ed., Vol. 1, pp. 229). The University of Western Australia.