Targeted sacrificial layer etching for MEMS release using microfluidic channels

Research output: Chapter in Book/Conference paper › Conference paper

Original language	English
Title of host publication	Proceedings of SPIE Micro+Nano Materials, Devices and Applications
Place of Publication	United States
Publisher	SPIE
Pages	8923Q-1 - 8923Q-6
Volume	8923
ISBN (Print)	0277786X13
DOIs	https://doi.org/10.1117/12.2033756
Publication status	Published - 2013
Event	SPIE Micro+Nano Materials, Devices, and Applications 2013 Conference - Melbourne, Australia Duration: 8 Dec 2013 → 11 Dec 2013

Conference	SPIE Micro+Nano Materials, Devices, and Applications 2013 Conference
Country	Australia
City	Melbourne
Period	8/12/13 → 11/12/13

Access to Document

@inproceedings{603ab4a0c3e44d74923679287483ed0b,

title = "Targeted sacrificial layer etching for MEMS release using microfluidic channels",

author = "Ben Cheah and Adrian Keating and John Dell",

year = "2013",

doi = "10.1117/12.2033756",

language = "English",

isbn = "0277786X13",

volume = "8923",

pages = "8923Q--1 -- 8923Q--6",

booktitle = "Proceedings of SPIE Micro+Nano Materials, Devices and Applications",

publisher = "SPIE",

address = "United States",

note = "SPIE Micro+Nano Materials, Devices, and Applications 2013 Conference ; Conference date: 08-12-2013 Through 11-12-2013",

}

Cheah, B, Keating, A & Dell, J 2013, Targeted sacrificial layer etching for MEMS release using microfluidic channels. in Proceedings of SPIE Micro+Nano Materials, Devices and Applications. vol. 8923, SPIE, United States , pp. 8923Q-1 - 8923Q-6, SPIE Micro+Nano Materials, Devices, and Applications 2013 Conference, Melbourne, Australia, 8/12/13. https://doi.org/10.1117/12.2033756

TY - GEN

T1 - Targeted sacrificial layer etching for MEMS release using microfluidic channels

AU - Cheah, Ben

AU - Keating, Adrian

AU - Dell, John

PY - 2013

Y1 - 2013

U2 - 10.1117/12.2033756

DO - 10.1117/12.2033756

M3 - Conference paper

SN - 0277786X13

VL - 8923

SP - 8923Q-1 - 8923Q-6

BT - Proceedings of SPIE Micro+Nano Materials, Devices and Applications

PB - SPIE

CY - United States

T2 - SPIE Micro+Nano Materials, Devices, and Applications 2013 Conference

Y2 - 8 December 2013 through 11 December 2013

ER -