Stress response of low temperature PECVD silicon nitride thin films to cryogenic thermal cycling

Research output: Chapter in Book/Conference paperConference paper

3 Citations (Scopus)
Original languageEnglish
Title of host publication2004 Conference on Optoelectronic and Microelectronic Materials and Devices Proceedings
EditorsAleksandar D. Raki&#263, Yew Tong Yeow
Place of PublicationUnited States
PublisherIEEE, Institute of Electrical and Electronics Engineers
Pages381-384
VolumeNot applicable
EditionBrisbane, Australia
ISBN (Print)0780388208
Publication statusPublished - 2005
EventStress response of low temperature PECVD silicon nitride thin films to cryogenic thermal cycling - Brisbane, Australia
Duration: 1 Jan 2005 → …

Conference

ConferenceStress response of low temperature PECVD silicon nitride thin films to cryogenic thermal cycling
Period1/01/05 → …

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