Signal integrity and radiated emissions of printed circuit board microstrips in digital switching

This thesis proposes methods for the modelling and analysis of signal integrity (SI) and radiated emission (RE) of capacitively loaded printed circuit board interconnections. Two techniques are considered for achieving a high level of SI, namely source series damping and destination parallel damping. Low order models are developed for the two methods which enable a comparison of their SI performance and the identification of the key parameters that affect SI. Under certain conditions the two methods are shown to have approximately the same SI performance. However, the two techniques can exhibit different characteristic in other respects, such as power dissipation, peak current and RE. One particular characteristic that is studied in the thesis is the performance with respect to far-field REs. A key objective of this thesis is to develop a quantitative analysis and a qualitative understanding of the interplay between electromagnetic compatibility/interference and SI for the two damping techniques.