Photolithography on porous silicon

Research output: Chapter in Book/Conference paperChapter

Abstract

Methods to transfer a pattern into porous silicon using light are reviewed. These methods can be applied before, during, or after the anodization processes. The advantages and disadvantages of each method are noted and technical performance compared using the aspect ratio of the pattern transferred into the porous silicon as a key metric. Based on this comparison, it is possible to group the various methods in a manner that allows specific applications to use the most appropriate patterningmethod.

Original languageEnglish
Title of host publicationHandbook of Porous Silicon
EditorsLeigh Canham
Place of PublicationSwitzerland
PublisherSpringer International Publishing AG
Pages797-804
Number of pages8
Volume2-2
Edition2
ISBN (Electronic)9783319713816
ISBN (Print)9783319713793
DOIs
Publication statusPublished - 4 Jul 2018

Fingerprint

Porous silicon
Photolithography
Silicon
photolithography
porous silicon
aspect ratio
Aspect ratio
Light

Cite this

Keating, A. (2018). Photolithography on porous silicon. In L. Canham (Ed.), Handbook of Porous Silicon (2 ed., Vol. 2-2, pp. 797-804). Switzerland: Springer International Publishing AG. https://doi.org/10.1007/978-3-319-71381-6_54
Keating, Adrian. / Photolithography on porous silicon. Handbook of Porous Silicon. editor / Leigh Canham. Vol. 2-2 2. ed. Switzerland : Springer International Publishing AG, 2018. pp. 797-804
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Keating, A 2018, Photolithography on porous silicon. in L Canham (ed.), Handbook of Porous Silicon. 2 edn, vol. 2-2, Springer International Publishing AG, Switzerland, pp. 797-804. https://doi.org/10.1007/978-3-319-71381-6_54

Photolithography on porous silicon. / Keating, Adrian.

Handbook of Porous Silicon. ed. / Leigh Canham. Vol. 2-2 2. ed. Switzerland : Springer International Publishing AG, 2018. p. 797-804.

Research output: Chapter in Book/Conference paperChapter

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Keating A. Photolithography on porous silicon. In Canham L, editor, Handbook of Porous Silicon. 2 ed. Vol. 2-2. Switzerland: Springer International Publishing AG. 2018. p. 797-804 https://doi.org/10.1007/978-3-319-71381-6_54