Modelling of damping characteristics in silicon-gold bilayer cantilevers

Research output: Chapter in Book/Conference paperConference paper

Abstract

This paper presents a simple method to extract the damping ratio of bilayer cantilevers using the static deflection profile of the released cantilevers. The extracted damping ratio is used to build a second order dynamical model of the cantilever. The model is validated by comparing the measured step response with the response predicted by the second order dynamical model.

Original languageEnglish
Title of host publication2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018
PublisherIEEE, Institute of Electrical and Electronics Engineers
Pages5-6
Number of pages2
ISBN (Electronic)9781538695241
DOIs
Publication statusPublished - 14 May 2019
Event2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018 - Perth, Australia
Duration: 9 Dec 201813 Dec 2018

Publication series

NameConference on Optoelectronic and Microelectronic Materials and Devices
PublisherIEEE
ISSN (Print)1097-2137

Conference

Conference2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018
CountryAustralia
CityPerth
Period9/12/1813/12/18

Fingerprint

Silicon
Gold
Damping
damping
gold
silicon
Step response
deflection
profiles

Cite this

Chenniappan, V., Silva, K. K. M. B. D., Umana-Membreno, G. A., Martyniuk, M., Keating, A., Dell, J. M., & Faraone, L. (2019). Modelling of damping characteristics in silicon-gold bilayer cantilevers. In 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018 (pp. 5-6). [8715248] (Conference on Optoelectronic and Microelectronic Materials and Devices). IEEE, Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/COMMAD.2018.8715248
Chenniappan, V. ; Silva, K. K.M.B.D. ; Umana-Membreno, G. A. ; Martyniuk, M. ; Keating, A. ; Dell, J. M. ; Faraone, L. / Modelling of damping characteristics in silicon-gold bilayer cantilevers. 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018. IEEE, Institute of Electrical and Electronics Engineers, 2019. pp. 5-6 (Conference on Optoelectronic and Microelectronic Materials and Devices).
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title = "Modelling of damping characteristics in silicon-gold bilayer cantilevers",
abstract = "This paper presents a simple method to extract the damping ratio of bilayer cantilevers using the static deflection profile of the released cantilevers. The extracted damping ratio is used to build a second order dynamical model of the cantilever. The model is validated by comparing the measured step response with the response predicted by the second order dynamical model.",
author = "V. Chenniappan and Silva, {K. K.M.B.D.} and Umana-Membreno, {G. A.} and M. Martyniuk and A. Keating and Dell, {J. M.} and L. Faraone",
year = "2019",
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language = "English",
series = "Conference on Optoelectronic and Microelectronic Materials and Devices",
publisher = "IEEE, Institute of Electrical and Electronics Engineers",
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Chenniappan, V, Silva, KKMBD, Umana-Membreno, GA, Martyniuk, M, Keating, A, Dell, JM & Faraone, L 2019, Modelling of damping characteristics in silicon-gold bilayer cantilevers. in 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018., 8715248, Conference on Optoelectronic and Microelectronic Materials and Devices, IEEE, Institute of Electrical and Electronics Engineers, pp. 5-6, 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018, Perth, Australia, 9/12/18. https://doi.org/10.1109/COMMAD.2018.8715248

Modelling of damping characteristics in silicon-gold bilayer cantilevers. / Chenniappan, V.; Silva, K. K.M.B.D.; Umana-Membreno, G. A.; Martyniuk, M.; Keating, A.; Dell, J. M.; Faraone, L.

2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018. IEEE, Institute of Electrical and Electronics Engineers, 2019. p. 5-6 8715248 (Conference on Optoelectronic and Microelectronic Materials and Devices).

Research output: Chapter in Book/Conference paperConference paper

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BT - 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018

PB - IEEE, Institute of Electrical and Electronics Engineers

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Chenniappan V, Silva KKMBD, Umana-Membreno GA, Martyniuk M, Keating A, Dell JM et al. Modelling of damping characteristics in silicon-gold bilayer cantilevers. In 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018. IEEE, Institute of Electrical and Electronics Engineers. 2019. p. 5-6. 8715248. (Conference on Optoelectronic and Microelectronic Materials and Devices). https://doi.org/10.1109/COMMAD.2018.8715248