Modeling and analysis of radiated emissions and signal integrity of capacitively loaded printed circuit board interconnections

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	1087-1096
Journal	IEEE Transactions on Electromagnetic Compatibility
Volume	54
DOIs	https://doi.org/10.1109/TEMC.2012.2187298
Publication status	Published - 2012

Access to Document

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title = "Modeling and analysis of radiated emissions and signal integrity of capacitively loaded printed circuit board interconnections",

author = "B.W.-J. Wong and Antonio Cantoni",

year = "2012",

doi = "10.1109/TEMC.2012.2187298",

language = "English",

volume = "54",

pages = "1087--1096",

journal = "IEEE Transactions on Electromagnetic Compatibility",

issn = "0018-9375",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

}

TY - JOUR

T1 - Modeling and analysis of radiated emissions and signal integrity of capacitively loaded printed circuit board interconnections

AU - Wong, B.W.-J.

AU - Cantoni, Antonio

PY - 2012

Y1 - 2012

U2 - 10.1109/TEMC.2012.2187298

DO - 10.1109/TEMC.2012.2187298

M3 - Article

SN - 0018-9375

VL - 54

SP - 1087

EP - 1096

JO - IEEE Transactions on Electromagnetic Compatibility

JF - IEEE Transactions on Electromagnetic Compatibility

ER -