MEMS device for quantitative in situ mechanical testing in electron microscope

X. Wang, S. Mao, J. Zhang, Z. Li, Q. Deng, J. Ning, X. Yang, L. Wang, Y. Ji, X. Li, Yinong Liu, Z. Zhang, X. Han

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

© 2017 by the authors.In this work, we designed a micro-electromechanical systems (MEMS) device that allows simultaneous direct measurement of mechanical properties during deformation under external stress and characterization of the evolution of nanomaterial microstructure within a transmission electron microscope. This MEMS device makes it easy to establish the correlation between microstructure and mechanical properties of nanomaterials. The device uses piezoresistive sensors to measure the force and displacement of nanomaterials qualitatively, e.g., in wire and thin plate forms. The device has a theoretical displacement resolution of 0.19 nm and a force resolution of 2.1 μN. The device has a theoretical displacement range limit of 5.47 μm and a load range limit of 55.0 mN.
Original languageEnglish
Article number31
JournalMicromachines
Volume8
Issue number2
DOIs
Publication statusPublished - 2017

    Fingerprint

Cite this

Wang, X., Mao, S., Zhang, J., Li, Z., Deng, Q., Ning, J., ... Han, X. (2017). MEMS device for quantitative in situ mechanical testing in electron microscope. Micromachines, 8(2), [31]. https://doi.org/10.3390/mi8020031