Low Temperature Through-Wafer Reactive Ion Etching for MEMS

Michal Zawierta; Jarek Antoszewski; Mariusz Martyniuk; Adrian Keating; Dilusha Silva; Gino Putrino; R. Jeffery; Lorenzo Faraone

Low Temperature Through-Wafer Reactive Ion Etching for MEMS

Research output: Chapter in Book/Conference paper › Conference paper › peer-review

Original language	English
Title of host publication	Proceedings of the 2014 Conference on Optoelectronic and Microelectronic Materials & Devices (COMMAD 2014)
Place of Publication	United States of America
Publisher	IEEE, Institute of Electrical and Electronics Engineers
Pages	83-86
Volume	1
ISBN (Print)	9781479968671
Publication status	Published - 2014
Event	Low Temperature Through-Wafer Reactive Ion Etching for MEMS - Perth, Western Australia Duration: 1 Jan 2014 → …

Conference

Conference	Low Temperature Through-Wafer Reactive Ion Etching for MEMS
Period	1/01/14 → …

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Cite this

@inproceedings{136d68d89aa0404882fc436257759b8b,

title = "Low Temperature Through-Wafer Reactive Ion Etching for MEMS",

author = "Michal Zawierta and Jarek Antoszewski and Mariusz Martyniuk and Adrian Keating and Dilusha Silva and Gino Putrino and R. Jeffery and Lorenzo Faraone",

year = "2014",

language = "English",

isbn = "9781479968671",

volume = "1",

pages = "83--86",

booktitle = "Proceedings of the 2014 Conference on Optoelectronic and Microelectronic Materials \& Devices (COMMAD 2014)",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

address = "United States",

note = "Low Temperature Through-Wafer Reactive Ion Etching for MEMS ; Conference date: 01-01-2014",

}

Zawierta, M , Antoszewski, J , Martyniuk, M , Keating, A , Silva, D , Putrino, G , Jeffery, R & Faraone, L 2014, Low Temperature Through-Wafer Reactive Ion Etching for MEMS. in Proceedings of the 2014 Conference on Optoelectronic and Microelectronic Materials & Devices (COMMAD 2014). vol. 1, IEEE, Institute of Electrical and Electronics Engineers, United States of America, pp. 83-86, Low Temperature Through-Wafer Reactive Ion Etching for MEMS, 1/01/14.

Low Temperature Through-Wafer Reactive Ion Etching for MEMS. / Zawierta, Michal ; Antoszewski, Jarek ; Martyniuk, Mariusz et al.
Proceedings of the 2014 Conference on Optoelectronic and Microelectronic Materials & Devices (COMMAD 2014). Vol. 1 United States of America: IEEE, Institute of Electrical and Electronics Engineers, 2014. p. 83-86.

Research output: Chapter in Book/Conference paper › Conference paper › peer-review

TY - GEN

T1 - Low Temperature Through-Wafer Reactive Ion Etching for MEMS

AU - Zawierta, Michal

AU - Antoszewski, Jarek

AU - Martyniuk, Mariusz

AU - Keating, Adrian

AU - Silva, Dilusha

AU - Putrino, Gino

AU - Jeffery, R.

AU - Faraone, Lorenzo

PY - 2014

Y1 - 2014

M3 - Conference paper

SN - 9781479968671

VL - 1

SP - 83

EP - 86

BT - Proceedings of the 2014 Conference on Optoelectronic and Microelectronic Materials & Devices (COMMAD 2014)

PB - IEEE, Institute of Electrical and Electronics Engineers

CY - United States of America

T2 - Low Temperature Through-Wafer Reactive Ion Etching for MEMS

Y2 - 1 January 2014

ER -