Lifetime prediction for solder joints with the extended finite element method

Alexander Menk, Chris J. Pearce, Olivier Lanier, Robert Simpson, Stéphane P A Bordas

Research output: Chapter in Book/Conference paperConference paper

4 Citations (Scopus)

Abstract

Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical methods are often used to predict the average lifetime of the critical joints. However, to get a reliable failure probability the standard deviation must also be addressed. The deviation of the lifetime from the mean value is a consequence of the variation in microstructure found in actual joints. We therefore propose a new methodology that calculates crack growth based on microstructural features of the joint. A series of random microstructures is generated. Crack growth calculations are performed for each of these structures. The structural problem is solved numerically with the extended finite element method which allows a complete automation of the process. The mean crack length and standard deviation are calculated from the crack growth simulations and the result is compared to experimental data.

Original languageEnglish
Title of host publication2011 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
EditorsMario Jungwirth
Place of PublicationAustria
PublisherIEEEE
ISBN (Print)9781457701078
DOIs
Publication statusPublished - 2011
Externally publishedYes
Event2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 - Linz, Austria
Duration: 17 Apr 201120 Apr 2011

Conference

Conference2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011
CountryAustria
CityLinz
Period17/04/1120/04/11

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