Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space

Tarun M. Sanders; Gino Putrino; Adrian Keating

doi:10.1109/COMMAD.2018.8715238

Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space

Tarun M. Sanders, Gino Putrino, Adrian Keating

Research output: Chapter in Book/Conference paper › Conference paper

1 Citation (Scopus)

Abstract

Studies are conducted into a novel method of fusing together existing high density coherent image fibre bundles (endoscopes) for the fabrication of image relays with a greater field-of-view and a larger number of resolvable pixels.

Original language	English
Title of host publication	2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018
Publisher	IEEE, Institute of Electrical and Electronics Engineers
Pages	27-30
Number of pages	4
ISBN (Electronic)	9781538695241
DOIs	https://doi.org/10.1109/COMMAD.2018.8715238
Publication status	Published - 14 May 2019
Event	2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018 - Perth, Australia Duration: 9 Dec 2018 → 13 Dec 2018

Publication series

Name	Conference on Optoelectronic and Microelectronic Materials and Devices
Publisher	IEEE
ISSN (Print)	1097-2137

Conference

Conference	2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018
Country	Australia
City	Perth
Period	9/12/18 → 13/12/18

Access to Document

10.1109/COMMAD.2018.8715238

Link to publication in Scopus

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Sanders, T. M., Putrino, G., & Keating, A. (2019). Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space. In 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018 (pp. 27-30). [8715238] (Conference on Optoelectronic and Microelectronic Materials and Devices). IEEE, Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/COMMAD.2018.8715238

Sanders, Tarun M. ; Putrino, Gino ; Keating, Adrian. / Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space. 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018. IEEE, Institute of Electrical and Electronics Engineers, 2019. pp. 27-30 (Conference on Optoelectronic and Microelectronic Materials and Devices).

@inproceedings{c70ec703c9654c2ca04f9ab19dd899d7,

title = "Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space",

abstract = "Studies are conducted into a novel method of fusing together existing high density coherent image fibre bundles (endoscopes) for the fabrication of image relays with a greater field-of-view and a larger number of resolvable pixels.",

author = "Sanders, {Tarun M.} and Gino Putrino and Adrian Keating",

year = "2019",

month = may,

day = "14",

doi = "10.1109/COMMAD.2018.8715238",

language = "English",

series = "Conference on Optoelectronic and Microelectronic Materials and Devices",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

pages = "27--30",

booktitle = "2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018",

address = "United States",

note = "2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018 ; Conference date: 09-12-2018 Through 13-12-2018",

}

Sanders, TM, Putrino, G & Keating, A 2019, Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space. in 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018., 8715238, Conference on Optoelectronic and Microelectronic Materials and Devices, IEEE, Institute of Electrical and Electronics Engineers, pp. 27-30, 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018, Perth, Australia, 9/12/18. https://doi.org/10.1109/COMMAD.2018.8715238

Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space. / Sanders, Tarun M.; Putrino, Gino ; Keating, Adrian.

2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018. IEEE, Institute of Electrical and Electronics Engineers, 2019. p. 27-30 8715238 (Conference on Optoelectronic and Microelectronic Materials and Devices).

Research output: Chapter in Book/Conference paper › Conference paper

TY - GEN

T1 - Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space

AU - Sanders, Tarun M.

AU - Putrino, Gino

AU - Keating, Adrian

PY - 2019/5/14

Y1 - 2019/5/14

N2 - Studies are conducted into a novel method of fusing together existing high density coherent image fibre bundles (endoscopes) for the fabrication of image relays with a greater field-of-view and a larger number of resolvable pixels.

AB - Studies are conducted into a novel method of fusing together existing high density coherent image fibre bundles (endoscopes) for the fabrication of image relays with a greater field-of-view and a larger number of resolvable pixels.

UR - http://www.scopus.com/inward/record.url?scp=85066747992&partnerID=8YFLogxK

U2 - 10.1109/COMMAD.2018.8715238

DO - 10.1109/COMMAD.2018.8715238

M3 - Conference paper

AN - SCOPUS:85066747992

T3 - Conference on Optoelectronic and Microelectronic Materials and Devices

SP - 27

EP - 30

BT - 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018

PB - IEEE, Institute of Electrical and Electronics Engineers

T2 - 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018

Y2 - 9 December 2018 through 13 December 2018

ER -

Sanders TM, Putrino G , Keating A. Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space. In 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018. IEEE, Institute of Electrical and Electronics Engineers. 2019. p. 27-30. 8715238. (Conference on Optoelectronic and Microelectronic Materials and Devices). https://doi.org/10.1109/COMMAD.2018.8715238