Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space

Tarun M. Sanders, Gino Putrino, Adrian Keating

Research output: Chapter in Book/Conference paperConference paper

Abstract

Studies are conducted into a novel method of fusing together existing high density coherent image fibre bundles (endoscopes) for the fabrication of image relays with a greater field-of-view and a larger number of resolvable pixels.

Original languageEnglish
Title of host publication2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018
PublisherIEEE, Institute of Electrical and Electronics Engineers
Pages27-30
Number of pages4
ISBN (Electronic)9781538695241
DOIs
Publication statusPublished - 14 May 2019
Event2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018 - Perth, Australia
Duration: 9 Dec 201813 Dec 2018

Publication series

NameConference on Optoelectronic and Microelectronic Materials and Devices
PublisherIEEE
ISSN (Print)1097-2137

Conference

Conference2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018
CountryAustralia
CityPerth
Period9/12/1813/12/18

Fingerprint

Endoscopy
bundles
Pixels
pixels
Imaging techniques
Fabrication
endoscopes
fabrication
fibers
Fibers
relay
field of view

Cite this

Sanders, T. M., Putrino, G., & Keating, A. (2019). Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space. In 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018 (pp. 27-30). [8715238] (Conference on Optoelectronic and Microelectronic Materials and Devices). IEEE, Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/COMMAD.2018.8715238
Sanders, Tarun M. ; Putrino, Gino ; Keating, Adrian. / Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space. 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018. IEEE, Institute of Electrical and Electronics Engineers, 2019. pp. 27-30 (Conference on Optoelectronic and Microelectronic Materials and Devices).
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abstract = "Studies are conducted into a novel method of fusing together existing high density coherent image fibre bundles (endoscopes) for the fabrication of image relays with a greater field-of-view and a larger number of resolvable pixels.",
author = "Sanders, {Tarun M.} and Gino Putrino and Adrian Keating",
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language = "English",
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Sanders, TM, Putrino, G & Keating, A 2019, Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space. in 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018., 8715238, Conference on Optoelectronic and Microelectronic Materials and Devices, IEEE, Institute of Electrical and Electronics Engineers, pp. 27-30, 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018, Perth, Australia, 9/12/18. https://doi.org/10.1109/COMMAD.2018.8715238

Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space. / Sanders, Tarun M.; Putrino, Gino; Keating, Adrian.

2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018. IEEE, Institute of Electrical and Electronics Engineers, 2019. p. 27-30 8715238 (Conference on Optoelectronic and Microelectronic Materials and Devices).

Research output: Chapter in Book/Conference paperConference paper

TY - GEN

T1 - Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space

AU - Sanders, Tarun M.

AU - Putrino, Gino

AU - Keating, Adrian

PY - 2019/5/14

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AB - Studies are conducted into a novel method of fusing together existing high density coherent image fibre bundles (endoscopes) for the fabrication of image relays with a greater field-of-view and a larger number of resolvable pixels.

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U2 - 10.1109/COMMAD.2018.8715238

DO - 10.1109/COMMAD.2018.8715238

M3 - Conference paper

T3 - Conference on Optoelectronic and Microelectronic Materials and Devices

SP - 27

EP - 30

BT - 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018

PB - IEEE, Institute of Electrical and Electronics Engineers

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Sanders TM, Putrino G, Keating A. Investigation of a novel method for the fabrication of larger area imaging fibre bundles with greater number of pixels and reduced dead space. In 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018. IEEE, Institute of Electrical and Electronics Engineers. 2019. p. 27-30. 8715238. (Conference on Optoelectronic and Microelectronic Materials and Devices). https://doi.org/10.1109/COMMAD.2018.8715238