Integrated bake/chill system for across-wafer temperature uniformity control in photoresist processing

Hui Chua, A. Tay, Y. Wang

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

An integrated bake/chill thermal processing module is developed and experimentally evaluated to achieve spatial temperature uniformity of a silicon wafer throughout the entire processing temperature cycle of ramp, hold, and quench in lithography. The module uses a set of thermoelectric devices which are used to provide distributed heating and cooling to the substrate for uniformity and transient temperature control. The experimental results demonstrate that the wafer spatial temperature uniformity is within ±0.3 and ±0.1 °C during transient and steady-state thermal processing, respectively.
Original languageEnglish
Pages (from-to)1211-1214
JournalJournal of Vacuum Science & Technology B
Volume27
Issue number3
DOIs
Publication statusPublished - 2009

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