Influence of the microstructure on the stress state of solder joints dusing thermal cycling

Alexander Menk; Stephane Bordas

doi:10.1109/ESIME.2009.4938405

Influence of the microstructure on the stress state of solder joints dusing thermal cycling

Alexander Menk, Stephane Bordas

Research output: Chapter in Book/Conference paper › Conference paper › peer-review

9 Citations (Scopus)

Abstract

The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the substrate. The stress state is heavily influenced by the anisotropy of tin. To understand the damage process in solder joints, the influence of the anisotropic microstructure must be understood. In this paper the influence of different grain sizes, shapes and orientations on the stress state is evaluated, based on numerical experiments.

Original language	English
Title of host publication	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
DOIs	https://doi.org/10.1109/ESIME.2009.4938405
Publication status	Published - 2009
Externally published	Yes
Event	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 - Delft, Netherlands Duration: 26 Apr 2009 → 29 Apr 2009

Conference

Conference	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
Country/Territory	Netherlands
City	Delft
Period	26/04/09 → 29/04/09

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10.1109/ESIME.2009.4938405

Cite this

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title = "Influence of the microstructure on the stress state of solder joints dusing thermal cycling",

abstract = "The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the substrate. The stress state is heavily influenced by the anisotropy of tin. To understand the damage process in solder joints, the influence of the anisotropic microstructure must be understood. In this paper the influence of different grain sizes, shapes and orientations on the stress state is evaluated, based on numerical experiments.",

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Menk, A & Bordas, S 2009, Influence of the microstructure on the stress state of solder joints dusing thermal cycling. in 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009., 4938405, 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009, Delft, Netherlands, 26/04/09. https://doi.org/10.1109/ESIME.2009.4938405

Influence of the microstructure on the stress state of solder joints dusing thermal cycling. / Menk, Alexander; Bordas, Stephane.
2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 2009. 4938405.

Research output: Chapter in Book/Conference paper › Conference paper › peer-review

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AU - Bordas, Stephane

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AB - The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the substrate. The stress state is heavily influenced by the anisotropy of tin. To understand the damage process in solder joints, the influence of the anisotropic microstructure must be understood. In this paper the influence of different grain sizes, shapes and orientations on the stress state is evaluated, based on numerical experiments.

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BT - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

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Y2 - 26 April 2009 through 29 April 2009

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Influence of the microstructure on the stress state of solder joints dusing thermal cycling

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