Influence of the microstructure on the stress state of solder joints dusing thermal cycling

Alexander Menk, Stephane Bordas

Research output: Chapter in Book/Conference paperConference paperpeer-review

8 Citations (Scopus)

Abstract

The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the substrate. The stress state is heavily influenced by the anisotropy of tin. To understand the damage process in solder joints, the influence of the anisotropic microstructure must be understood. In this paper the influence of different grain sizes, shapes and orientations on the stress state is evaluated, based on numerical experiments.

Original languageEnglish
Title of host publication2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
DOIs
Publication statusPublished - 2009
Externally publishedYes
Event2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 - Delft, Netherlands
Duration: 26 Apr 200929 Apr 2009

Conference

Conference2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
Country/TerritoryNetherlands
CityDelft
Period26/04/0929/04/09

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