Evaluation of elastic modulus and hardness of thin films by nanoindentation

Y-G. Jung, B.R. Lawn, Mariusz Martyniuk, H. Huang, Xiao Hu

    Research output: Contribution to journalArticle

    163 Citations (Scopus)

    Abstract

    Simple equations are proposed for determining elastic modulus and hardness properties of thin films on substrates from nanoindentation experiments. An empirical formulation relates the modulus E and hardness H of the film/substrate bilayer to corresponding material properties of the constituent materials via a power-law relation. Geometrical dependence of E and H is wholly contained in the power-law exponents, expressed here as sigmoidal functions of indenter penetration relative to film thickness. The formulation may be inverted to enable deconvolution of film properties from data on the film/substrate bilayers. Berkovich nanoindentation data for dense oxide and nitride films on silicon substrates are used to validate the equations and to demonstrate the film property deconvolution. Additional data for less dense nitride films are used to illustrate the extent to which film properties may depend on the method of fabrication.
    Original languageEnglish
    Pages (from-to)3076-3080
    JournalJournal of Materials Research
    Volume19
    Issue number10
    DOIs
    Publication statusPublished - 2004

    Fingerprint

    Nanoindentation
    nanoindentation
    modulus of elasticity
    hardness
    Elastic moduli
    Hardness
    Thin films
    evaluation
    thin films
    Deconvolution
    Substrates
    Nitrides
    nitrides
    formulations
    Silicon
    Oxides
    Film thickness
    oxide films
    Materials properties
    film thickness

    Cite this

    @article{64e5fa0f377a42358f9e1e823cccc7d4,
    title = "Evaluation of elastic modulus and hardness of thin films by nanoindentation",
    abstract = "Simple equations are proposed for determining elastic modulus and hardness properties of thin films on substrates from nanoindentation experiments. An empirical formulation relates the modulus E and hardness H of the film/substrate bilayer to corresponding material properties of the constituent materials via a power-law relation. Geometrical dependence of E and H is wholly contained in the power-law exponents, expressed here as sigmoidal functions of indenter penetration relative to film thickness. The formulation may be inverted to enable deconvolution of film properties from data on the film/substrate bilayers. Berkovich nanoindentation data for dense oxide and nitride films on silicon substrates are used to validate the equations and to demonstrate the film property deconvolution. Additional data for less dense nitride films are used to illustrate the extent to which film properties may depend on the method of fabrication.",
    author = "Y-G. Jung and B.R. Lawn and Mariusz Martyniuk and H. Huang and Xiao Hu",
    year = "2004",
    doi = "10.1557/JMR.2004.0380",
    language = "English",
    volume = "19",
    pages = "3076--3080",
    journal = "Journal of Materials Research",
    issn = "0884-2914",
    publisher = "Materials Research Society",
    number = "10",

    }

    Evaluation of elastic modulus and hardness of thin films by nanoindentation. / Jung, Y-G.; Lawn, B.R.; Martyniuk, Mariusz; Huang, H.; Hu, Xiao.

    In: Journal of Materials Research, Vol. 19, No. 10, 2004, p. 3076-3080.

    Research output: Contribution to journalArticle

    TY - JOUR

    T1 - Evaluation of elastic modulus and hardness of thin films by nanoindentation

    AU - Jung, Y-G.

    AU - Lawn, B.R.

    AU - Martyniuk, Mariusz

    AU - Huang, H.

    AU - Hu, Xiao

    PY - 2004

    Y1 - 2004

    N2 - Simple equations are proposed for determining elastic modulus and hardness properties of thin films on substrates from nanoindentation experiments. An empirical formulation relates the modulus E and hardness H of the film/substrate bilayer to corresponding material properties of the constituent materials via a power-law relation. Geometrical dependence of E and H is wholly contained in the power-law exponents, expressed here as sigmoidal functions of indenter penetration relative to film thickness. The formulation may be inverted to enable deconvolution of film properties from data on the film/substrate bilayers. Berkovich nanoindentation data for dense oxide and nitride films on silicon substrates are used to validate the equations and to demonstrate the film property deconvolution. Additional data for less dense nitride films are used to illustrate the extent to which film properties may depend on the method of fabrication.

    AB - Simple equations are proposed for determining elastic modulus and hardness properties of thin films on substrates from nanoindentation experiments. An empirical formulation relates the modulus E and hardness H of the film/substrate bilayer to corresponding material properties of the constituent materials via a power-law relation. Geometrical dependence of E and H is wholly contained in the power-law exponents, expressed here as sigmoidal functions of indenter penetration relative to film thickness. The formulation may be inverted to enable deconvolution of film properties from data on the film/substrate bilayers. Berkovich nanoindentation data for dense oxide and nitride films on silicon substrates are used to validate the equations and to demonstrate the film property deconvolution. Additional data for less dense nitride films are used to illustrate the extent to which film properties may depend on the method of fabrication.

    U2 - 10.1557/JMR.2004.0380

    DO - 10.1557/JMR.2004.0380

    M3 - Article

    VL - 19

    SP - 3076

    EP - 3080

    JO - Journal of Materials Research

    JF - Journal of Materials Research

    SN - 0884-2914

    IS - 10

    ER -