Engineering porous silicon thin films to obtain high TCR and low 1/f noise for application in thermal detectors

Pritam Sharma; Xiao Sun; Giacinta Parish; Adrian Keating

doi:10.1109/COMMAD.2018.8715243

Engineering porous silicon thin films to obtain high TCR and low 1/f noise for application in thermal detectors

Pritam Sharma, Xiao Sun, Giacinta Parish, Adrian Keating

Research output: Chapter in Book/Conference paper › Conference paper › peer-review

13 Downloads (Pure)

Abstract

This paper reviews the temperature coefficient of resistance (TCR) and 1/f noise characteristics in porous silicon, to explore its possible application as a sensing element in high sensitivity based uncooled thermal detectors. These electrical characteristics are key parameters determining the sensitivity of thermal imaging cameras. Engineering the electrical properties of porous silicon thin films to improve the sensitivity of thermal detectors would significantly improve imaging quality compared to current night vision systems in automobiles, surveillance and industrial monitoring applications.

Original language	English
Title of host publication	2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018
Place of Publication	USA
Publisher	IEEE, Institute of Electrical and Electronics Engineers
Pages	31-34
Number of pages	4
ISBN (Electronic)	9781538695241
ISBN (Print)	978-1-5386-9525-8
DOIs	https://doi.org/10.1109/COMMAD.2018.8715243
Publication status	Published - 2 Jul 2018
Event	2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018 - Perth, Australia Duration: 9 Dec 2018 → 13 Dec 2018

Publication series

Name	2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018

Conference

Conference	2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018
Country/Territory	Australia
City	Perth
Period	9/12/18 → 13/12/18

Access to Document

10.1109/COMMAD.2018.8715243

Cite this

Sharma, P., Sun, X., Parish, G., & Keating, A. (2018). Engineering porous silicon thin films to obtain high TCR and low 1/f noise for application in thermal detectors. In 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018 (pp. 31-34). Article 8715243 (2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018). IEEE, Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/COMMAD.2018.8715243

Sharma, Pritam ; Sun, Xiao ; Parish, Giacinta et al. / Engineering porous silicon thin films to obtain high TCR and low 1/f noise for application in thermal detectors. 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018. USA : IEEE, Institute of Electrical and Electronics Engineers, 2018. pp. 31-34 (2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018).

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title = "Engineering porous silicon thin films to obtain high TCR and low 1/f noise for application in thermal detectors",

abstract = "This paper reviews the temperature coefficient of resistance (TCR) and 1/f noise characteristics in porous silicon, to explore its possible application as a sensing element in high sensitivity based uncooled thermal detectors. These electrical characteristics are key parameters determining the sensitivity of thermal imaging cameras. Engineering the electrical properties of porous silicon thin films to improve the sensitivity of thermal detectors would significantly improve imaging quality compared to current night vision systems in automobiles, surveillance and industrial monitoring applications.",

author = "Pritam Sharma and Xiao Sun and Giacinta Parish and Adrian Keating",

year = "2018",

month = jul,

day = "2",

doi = "10.1109/COMMAD.2018.8715243",

language = "English",

isbn = "978-1-5386-9525-8",

series = "2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

pages = "31--34",

booktitle = "2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018",

address = "United States",

note = "2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018 ; Conference date: 09-12-2018 Through 13-12-2018",

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Sharma, P, Sun, X , Parish, G & Keating, A 2018, Engineering porous silicon thin films to obtain high TCR and low 1/f noise for application in thermal detectors. in 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018., 8715243, 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018, IEEE, Institute of Electrical and Electronics Engineers, USA, pp. 31-34, 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018, Perth, Australia, 9/12/18. https://doi.org/10.1109/COMMAD.2018.8715243

Engineering porous silicon thin films to obtain high TCR and low 1/f noise for application in thermal detectors. / Sharma, Pritam; Sun, Xiao ; Parish, Giacinta et al.
2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018. USA: IEEE, Institute of Electrical and Electronics Engineers, 2018. p. 31-34 8715243 (2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018).

Research output: Chapter in Book/Conference paper › Conference paper › peer-review

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PB - IEEE, Institute of Electrical and Electronics Engineers

CY - USA

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Sharma P, Sun X , Parish G , Keating A. Engineering porous silicon thin films to obtain high TCR and low 1/f noise for application in thermal detectors. In 2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018. USA: IEEE, Institute of Electrical and Electronics Engineers. 2018. p. 31-34. 8715243. (2018 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2018). doi: 10.1109/COMMAD.2018.8715243

Engineering porous silicon thin films to obtain high TCR and low 1/f noise for application in thermal detectors

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

A new technology platform for high speed, high sensitivity thermal imaging

Cite this

Engineering porous silicon thin films to obtain high TCR and low 1/f noise for application in thermal detectors

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Projects

A new technology platform for high speed, high sensitivity thermal imaging

Cite this