Efficiency of the meshless local Petrov-Galerkin method with moving least squares approximation for thermal conduction applications

Nikolaos P. Karagiannakis, George C. Bourantas, Alexandros N. Kalarakis, Eugene D. Skouras, Vasilis N. Burganos

Research output: Chapter in Book/Conference paperConference paper

2 Citations (Scopus)

Abstract

A numerical solution of steady-state heat conduction problem with variable conductivity in 2D space is obtained using the meshless local Petrov-Galerkin (MLPG) method. The essential boundary condition is enforced by the transformation method. The approximation of the field variables is performed using Moving Least Squares (MLS) interpolation. The accuracy and the efficiency of the MLPG schemes are investigated through variation of i) the domain resolution, ii) the order of the basis functions, and iii) the conductivity range. Steady-state boundary conditions of the essential type are assumed. The results are compared with those calculated by typical Finite Element, Finite Difference, and Lattice-Boltzmann Methods. Appropriate combination of the 1 st and the 2nd order basis functions is proposed (hybrid order), and the accuracy and the efficiency of the method are demonstrated in all cases studied.

Original languageEnglish
Title of host publication11th International Conference of Numerical Analysis and Applied Mathematics 2013, ICNAAM 2013
Place of PublicationGreece
PublisherAmerican Institute of Physics
Pages2269-2272
Number of pages4
Volume1558
ISBN (Print)9780735411845
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event11th International Conference of Numerical Analysis and Applied Mathematics 2013, ICNAAM 2013 - Rhodes, Greece
Duration: 21 Sep 201327 Sep 2013

Conference

Conference11th International Conference of Numerical Analysis and Applied Mathematics 2013, ICNAAM 2013
CountryGreece
CityRhodes
Period21/09/1327/09/13

Fingerprint Dive into the research topics of 'Efficiency of the meshless local Petrov-Galerkin method with moving least squares approximation for thermal conduction applications'. Together they form a unique fingerprint.

Cite this