Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films

H. Huang; K.J. Winchester; Alexandra Suvorova; B.R. Lawn; Yinong Liu; Xiao Hu; John Dell; Lorenzo Faraone

doi:10.1016/j.msea.2006.07.015

Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films

H. Huang, K.J. Winchester, Alexandra Suvorova, B.R. Lawn, Yinong Liu, Xiao Hu, John Dell, Lorenzo Faraone

Research output: Contribution to journal › Article › peer-review

181 Citations (Scopus)

Abstract

The effect of deposition conditions on characteristic mechanical properties - elastic modulus and hardness - of low-temperature PECVD silicon nitrides is investigated using nanoindentation. lt is found that increase in substrate temperature, increase in plasma power and decrease in chamber gas pressure all result in increases in elastic modulus and hardness. Strong correlations between the mechanical properties and film density are demonstrated. The silicon nitride density in turn is shown to be related to the chemical composition of the films, particularly the silicon/nitrogen ratio. (c) 2006 Elsevier B.V. All rights reserved.

Original language	English
Pages (from-to)	453-459
Journal	Materials Science and Engineering A
Volume	435-436
DOIs	https://doi.org/10.1016/j.msea.2006.07.015
Publication status	Published - 2006

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10.1016/j.msea.2006.07.015

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title = "Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films",

abstract = "The effect of deposition conditions on characteristic mechanical properties - elastic modulus and hardness - of low-temperature PECVD silicon nitrides is investigated using nanoindentation. lt is found that increase in substrate temperature, increase in plasma power and decrease in chamber gas pressure all result in increases in elastic modulus and hardness. Strong correlations between the mechanical properties and film density are demonstrated. The silicon nitride density in turn is shown to be related to the chemical composition of the films, particularly the silicon/nitrogen ratio. (c) 2006 Elsevier B.V. All rights reserved.",

author = "H. Huang and K.J. Winchester and Alexandra Suvorova and B.R. Lawn and Yinong Liu and Xiao Hu and John Dell and Lorenzo Faraone",

year = "2006",

doi = "10.1016/j.msea.2006.07.015",

language = "English",

volume = "435-436",

pages = "453--459",

journal = "Materials Science and Engineering A",

issn = "0921-5093",

publisher = "Elsevier",

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TY - JOUR

T1 - Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films

AU - Huang, H.

AU - Winchester, K.J.

AU - Suvorova, Alexandra

AU - Lawn, B.R.

AU - Liu, Yinong

AU - Hu, Xiao

AU - Dell, John

AU - Faraone, Lorenzo

PY - 2006

Y1 - 2006

N2 - The effect of deposition conditions on characteristic mechanical properties - elastic modulus and hardness - of low-temperature PECVD silicon nitrides is investigated using nanoindentation. lt is found that increase in substrate temperature, increase in plasma power and decrease in chamber gas pressure all result in increases in elastic modulus and hardness. Strong correlations between the mechanical properties and film density are demonstrated. The silicon nitride density in turn is shown to be related to the chemical composition of the films, particularly the silicon/nitrogen ratio. (c) 2006 Elsevier B.V. All rights reserved.

AB - The effect of deposition conditions on characteristic mechanical properties - elastic modulus and hardness - of low-temperature PECVD silicon nitrides is investigated using nanoindentation. lt is found that increase in substrate temperature, increase in plasma power and decrease in chamber gas pressure all result in increases in elastic modulus and hardness. Strong correlations between the mechanical properties and film density are demonstrated. The silicon nitride density in turn is shown to be related to the chemical composition of the films, particularly the silicon/nitrogen ratio. (c) 2006 Elsevier B.V. All rights reserved.

U2 - 10.1016/j.msea.2006.07.015

DO - 10.1016/j.msea.2006.07.015

M3 - Article

SN - 0921-5093

VL - 435-436

SP - 453

EP - 459

JO - Materials Science and Engineering A

JF - Materials Science and Engineering A

ER -

Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films

Abstract

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