Digital image correlation to analyze nonlinear elastic behavior of materials

Research output: Chapter in Book/Conference paperConference paper

1 Citation (Scopus)

Abstract

Photogrammetry and image processing have been used extensively to examine surface deformations. Digital Image Correlation (DIC) detects the two-dimensional subpixel displacements between two images in order to analyze deformations in geomechanical structures. In this study, the case of large deformations involving nonlinear elastic behavior of the material has been examined with the use of a physical model of Ethylene Vinyl Acetate (EVA) foam subject to axial strain up to 15%. The associated strain and displacement fields are reconstructed using DIC and compared with the Finite Element Method. DIC is used to analyze the critical hysteresis effect of the material which occurs during loading and unloading process. The results show that DIC is a reliable technique to analyze the nonlinear elastic behavior of materials.

Original languageEnglish
Title of host publication2017 IEEE International Conference on Image Processing, ICIP 2017 - Proceedings
Place of PublicationUnited States
PublisherIEEE, Institute of Electrical and Electronics Engineers
Pages4367-4371
Number of pages5
Volume2017-September
ISBN (Electronic)9781509021758
ISBN (Print)9781509021765
DOIs
Publication statusPublished - 20 Feb 2018
Event24th IEEE International Conference on Image Processing, ICIP 2017 - Beijing, China
Duration: 17 Sep 201720 Sep 2017

Conference

Conference24th IEEE International Conference on Image Processing, ICIP 2017
CountryChina
CityBeijing
Period17/09/1720/09/17

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