Digital image correlation to analyze nonlinear elastic behavior of materials

Research output: Chapter in Book/Conference paperConference paperpeer-review

4 Citations (Scopus)


Photogrammetry and image processing have been used extensively to examine surface deformations. Digital Image Correlation (DIC) detects the two-dimensional subpixel displacements between two images in order to analyze deformations in geomechanical structures. In this study, the case of large deformations involving nonlinear elastic behavior of the material has been examined with the use of a physical model of Ethylene Vinyl Acetate (EVA) foam subject to axial strain up to 15%. The associated strain and displacement fields are reconstructed using DIC and compared with the Finite Element Method. DIC is used to analyze the critical hysteresis effect of the material which occurs during loading and unloading process. The results show that DIC is a reliable technique to analyze the nonlinear elastic behavior of materials.

Original languageEnglish
Title of host publication2017 IEEE International Conference on Image Processing, ICIP 2017 - Proceedings
Place of PublicationUnited States
PublisherIEEE, Institute of Electrical and Electronics Engineers
Number of pages5
ISBN (Electronic)9781509021758
ISBN (Print)9781509021765
Publication statusPublished - 20 Feb 2018
Event2017 IEEE International Conference on Image Processing - Beijing, China
Duration: 17 Sept 201720 Sept 2017
Conference number: 24th


Conference2017 IEEE International Conference on Image Processing
Abbreviated titleICIP 2017


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