Determination of residual stress in low temperature PECVD silicon nitride thin films

Mariusz Martyniuk; Jarek Antoszewski; Charles Musca; John Dell; Lorenzo Faraone

Determination of residual stress in low temperature PECVD silicon nitride thin films

Mariusz Martyniuk, Jarek Antoszewski, Charles Musca, John Dell, Lorenzo Faraone

Graduate Research School

Research output: Chapter in Book/Conference paper › Conference paper › peer-review

Original language	English
Title of host publication	Proceeding of SPIE: Device and Process Technologies for MEMS, Microelectronics, and Photonics III
Editors	Jung-Chih Chiao, Alex J. Hariz, David N. Jamieson, Giacinta Parish, Vijay K. Varadan
Place of Publication	Bellingham, Washington, USA
Publisher	SPIE
Pages	451-462
Volume	5276
Edition	Perth, Western Australia
ISBN (Print)	081945169X
Publication status	Published - 2004
Event	Determination of residual stress in low temperature PECVD silicon nitride thin films - Perth, Western Australia Duration: 1 Jan 2004 → …

Conference

Conference	Determination of residual stress in low temperature PECVD silicon nitride thin films
Period	1/01/04 → …

Cite this

Martyniuk, M., Antoszewski, J., Musca, C., Dell, J., & Faraone, L. (2004). Determination of residual stress in low temperature PECVD silicon nitride thin films. In J.-C. Chiao, A. J. Hariz, D. N. Jamieson, G. Parish, & V. K. Varadan (Eds.), Proceeding of SPIE: Device and Process Technologies for MEMS, Microelectronics, and Photonics III (Perth, Western Australia ed., Vol. 5276, pp. 451-462). SPIE.

Martyniuk, Mariusz ; Antoszewski, Jarek ; Musca, Charles et al. / Determination of residual stress in low temperature PECVD silicon nitride thin films. Proceeding of SPIE: Device and Process Technologies for MEMS, Microelectronics, and Photonics III. editor / Jung-Chih Chiao ; Alex J. Hariz ; David N. Jamieson ; Giacinta Parish ; Vijay K. Varadan. Vol. 5276 Perth, Western Australia. ed. Bellingham, Washington, USA : SPIE, 2004. pp. 451-462

@inproceedings{ae300c9e9f12457f9a666f22f7380dbd,

title = "Determination of residual stress in low temperature PECVD silicon nitride thin films",

author = "Mariusz Martyniuk and Jarek Antoszewski and Charles Musca and John Dell and Lorenzo Faraone",

year = "2004",

language = "English",

isbn = "081945169X",

volume = "5276",

pages = "451--462",

editor = "Jung-Chih Chiao and Hariz, {Alex J.} and Jamieson, {David N.} and Giacinta Parish and Varadan, {Vijay K.}",

booktitle = "Proceeding of SPIE: Device and Process Technologies for MEMS, Microelectronics, and Photonics III",

publisher = "SPIE",

address = "United States",

edition = "Perth, Western Australia",

note = "Determination of residual stress in low temperature PECVD silicon nitride thin films ; Conference date: 01-01-2004",

}

Martyniuk, M , Antoszewski, J, Musca, C, Dell, J & Faraone, L 2004, Determination of residual stress in low temperature PECVD silicon nitride thin films. in J-C Chiao, AJ Hariz, DN Jamieson, G Parish & VK Varadan (eds), Proceeding of SPIE: Device and Process Technologies for MEMS, Microelectronics, and Photonics III. Perth, Western Australia edn, vol. 5276, SPIE, Bellingham, Washington, USA, pp. 451-462, Determination of residual stress in low temperature PECVD silicon nitride thin films, 1/01/04.

Determination of residual stress in low temperature PECVD silicon nitride thin films. / Martyniuk, Mariusz ; Antoszewski, Jarek; Musca, Charles et al.
Proceeding of SPIE: Device and Process Technologies for MEMS, Microelectronics, and Photonics III. ed. / Jung-Chih Chiao; Alex J. Hariz; David N. Jamieson; Giacinta Parish; Vijay K. Varadan. Vol. 5276 Perth, Western Australia. ed. Bellingham, Washington, USA: SPIE, 2004. p. 451-462.

Research output: Chapter in Book/Conference paper › Conference paper › peer-review

TY - GEN

T1 - Determination of residual stress in low temperature PECVD silicon nitride thin films

AU - Martyniuk, Mariusz

AU - Antoszewski, Jarek

AU - Musca, Charles

AU - Dell, John

AU - Faraone, Lorenzo

PY - 2004

Y1 - 2004

M3 - Conference paper

SN - 081945169X

VL - 5276

SP - 451

EP - 462

BT - Proceeding of SPIE: Device and Process Technologies for MEMS, Microelectronics, and Photonics III

A2 - Chiao, Jung-Chih

A2 - Hariz, Alex J.

A2 - Jamieson, David N.

A2 - Parish, Giacinta

A2 - Varadan, Vijay K.

PB - SPIE

CY - Bellingham, Washington, USA

T2 - Determination of residual stress in low temperature PECVD silicon nitride thin films

Y2 - 1 January 2004

ER -

Martyniuk M , Antoszewski J, Musca C, Dell J , Faraone L. Determination of residual stress in low temperature PECVD silicon nitride thin films. In Chiao JC, Hariz AJ, Jamieson DN, Parish G, Varadan VK, editors, Proceeding of SPIE: Device and Process Technologies for MEMS, Microelectronics, and Photonics III. Perth, Western Australia ed. Vol. 5276. Bellingham, Washington, USA: SPIE. 2004. p. 451-462