Determination of residual stress in low temperature PECVD silicon nitride thin films

Research output: Chapter in Book/Conference paperConference paper

12 Citations (Scopus)
Original languageEnglish
Title of host publicationProceeding of SPIE: Device and Process Technologies for MEMS, Microelectronics, and Photonics III
EditorsJung-Chih Chiao, Alex J. Hariz, David N. Jamieson, Giacinta Parish, Vijay K. Varadan
Place of PublicationBellingham, Washington, USA
PublisherSPIE
Pages451-462
Volume5276
EditionPerth, Western Australia
ISBN (Print)081945169X
Publication statusPublished - 2004
EventDetermination of residual stress in low temperature PECVD silicon nitride thin films - Perth, Western Australia
Duration: 1 Jan 2004 → …

Conference

ConferenceDetermination of residual stress in low temperature PECVD silicon nitride thin films
Period1/01/04 → …

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