Demonstration of Chip-To-Chip Quantum Teleportation

Y. DIng, D. Llewellyn, I. Faruque, S. Paesani, D. Bacco, R. Santagati, Y. Qian, Y. Li, Y. Xiao, M. Huber, M. Malik, G. Sinclair, X. Zhou, K. Rottwitt, J. O'Brien, J. Rarity, Q. Gong, L. Oxenlowe, J. Wang, M. Thompson

Research output: Chapter in Book/Conference paperConference paper

1 Citation (Scopus)

Abstract

We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.

Original languageEnglish
Title of host publication2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings
PublisherIEEE, Institute of Electrical and Electronics Engineers
ISBN (Electronic)9781943580576
DOIs
Publication statusPublished - 1 May 2019
Externally publishedYes
Event2019 Conference on Lasers and Electro-Optics, CLEO 2019 - San Jose, United States
Duration: 5 May 201910 May 2019
https://www.cleoconference.org/library/images/cleo/Archive/CLEO-Archive-2019.pdf

Publication series

Name2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings

Conference

Conference2019 Conference on Lasers and Electro-Optics, CLEO 2019
CountryUnited States
CitySan Jose
Period5/05/1910/05/19
Internet address

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Cite this

DIng, Y., Llewellyn, D., Faruque, I., Paesani, S., Bacco, D., Santagati, R., ... Thompson, M. (2019). Demonstration of Chip-To-Chip Quantum Teleportation. In 2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings [8750050] (2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings). IEEE, Institute of Electrical and Electronics Engineers. https://doi.org/10.23919/CLEO.2019.8750050