Demonstration of Chip-To-Chip Quantum Teleportation

Y. DIng; D. Llewellyn; I. Faruque; S. Paesani; D. Bacco; R. Santagati; Y. Qian; Y. Li; Y. Xiao; M. Huber; M. Malik; G. Sinclair; X. Zhou; K. Rottwitt; J. O'Brien; J. Rarity; Q. Gong; L. Oxenlowe; J. Wang; M. Thompson

doi:10.23919/CLEO.2019.8750050

Demonstration of Chip-To-Chip Quantum Teleportation

Y. DIng, D. Llewellyn, I. Faruque, S. Paesani, D. Bacco, R. Santagati, Y. Qian, Y. Li, Y. Xiao, M. Huber, M. Malik, G. Sinclair, X. Zhou, K. Rottwitt, J. O'Brien, J. Rarity, Q. Gong, L. Oxenlowe, J. Wang, M. Thompson

Research output: Chapter in Book/Conference paper › Conference paper › peer-review

3 Citations (Scopus)

Abstract

We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.

Original language	English
Title of host publication	2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings
Publisher	IEEE, Institute of Electrical and Electronics Engineers
ISBN (Electronic)	9781943580576
DOIs	https://doi.org/10.23919/CLEO.2019.8750050
Publication status	Published - 1 May 2019
Externally published	Yes
Event	2019 Conference on Lasers and Electro-Optics, CLEO 2019 - San Jose, United States Duration: 5 May 2019 → 10 May 2019 https://www.cleoconference.org/library/images/cleo/Archive/CLEO-Archive-2019.pdf

Publication series

Name	2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings

Conference

Conference	2019 Conference on Lasers and Electro-Optics, CLEO 2019
Country/Territory	United States
City	San Jose
Period	5/05/19 → 10/05/19
Internet address	https://www.cleoconference.org/library/images/cleo/Archive/CLEO-Archive-2019.pdf

Access to Document

10.23919/CLEO.2019.8750050

Cite this

DIng, Y., Llewellyn, D., Faruque, I., Paesani, S., Bacco, D., Santagati, R., Qian, Y., Li, Y., Xiao, Y., Huber, M., Malik, M., Sinclair, G., Zhou, X., Rottwitt, K., O'Brien, J., Rarity, J., Gong, Q., Oxenlowe, L., Wang, J., & Thompson, M. (2019). Demonstration of Chip-To-Chip Quantum Teleportation. In 2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings Article 8750050 (2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings). IEEE, Institute of Electrical and Electronics Engineers. https://doi.org/10.23919/CLEO.2019.8750050

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title = "Demonstration of Chip-To-Chip Quantum Teleportation",

abstract = "We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.",

author = "Y. DIng and D. Llewellyn and I. Faruque and S. Paesani and D. Bacco and R. Santagati and Y. Qian and Y. Li and Y. Xiao and M. Huber and M. Malik and G. Sinclair and X. Zhou and K. Rottwitt and J. O'Brien and J. Rarity and Q. Gong and L. Oxenlowe and J. Wang and M. Thompson",

year = "2019",

month = may,

day = "1",

doi = "10.23919/CLEO.2019.8750050",

language = "English",

series = "2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

booktitle = "2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings",

address = "United States",

note = "2019 Conference on Lasers and Electro-Optics, CLEO 2019 ; Conference date: 05-05-2019 Through 10-05-2019",

url = "https://www.cleoconference.org/library/images/cleo/Archive/CLEO-Archive-2019.pdf",

}

DIng, Y, Llewellyn, D, Faruque, I, Paesani, S, Bacco, D, Santagati, R, Qian, Y, Li, Y, Xiao, Y, Huber, M, Malik, M, Sinclair, G, Zhou, X, Rottwitt, K, O'Brien, J, Rarity, J, Gong, Q, Oxenlowe, L, Wang, J & Thompson, M 2019, Demonstration of Chip-To-Chip Quantum Teleportation. in 2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings., 8750050, 2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings, IEEE, Institute of Electrical and Electronics Engineers, 2019 Conference on Lasers and Electro-Optics, CLEO 2019, San Jose, California, United States, 5/05/19. https://doi.org/10.23919/CLEO.2019.8750050

Demonstration of Chip-To-Chip Quantum Teleportation. / DIng, Y.; Llewellyn, D.; Faruque, I. et al.
2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings. IEEE, Institute of Electrical and Electronics Engineers, 2019. 8750050 (2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings).

Research output: Chapter in Book/Conference paper › Conference paper › peer-review

TY - GEN

T1 - Demonstration of Chip-To-Chip Quantum Teleportation

AU - DIng, Y.

AU - Llewellyn, D.

AU - Faruque, I.

AU - Paesani, S.

AU - Bacco, D.

AU - Santagati, R.

AU - Qian, Y.

AU - Li, Y.

AU - Xiao, Y.

AU - Huber, M.

AU - Malik, M.

AU - Sinclair, G.

AU - Zhou, X.

AU - Rottwitt, K.

AU - O'Brien, J.

AU - Rarity, J.

AU - Gong, Q.

AU - Oxenlowe, L.

AU - Wang, J.

AU - Thompson, M.

PY - 2019/5/1

Y1 - 2019/5/1

N2 - We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.

AB - We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.

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DO - 10.23919/CLEO.2019.8750050

M3 - Conference paper

AN - SCOPUS:85069225896

T3 - 2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings

BT - 2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings

PB - IEEE, Institute of Electrical and Electronics Engineers

T2 - 2019 Conference on Lasers and Electro-Optics, CLEO 2019

Y2 - 5 May 2019 through 10 May 2019

ER -

DIng Y, Llewellyn D, Faruque I, Paesani S, Bacco D, Santagati R et al. Demonstration of Chip-To-Chip Quantum Teleportation. In 2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings. IEEE, Institute of Electrical and Electronics Engineers. 2019. 8750050. (2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings). doi: 10.23919/CLEO.2019.8750050

Demonstration of Chip-To-Chip Quantum Teleportation

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