Characterisation of thermal and thermoelectric properties of porous silicon thin films

Sobhan Erfantalab

doi:10.26182/qtxb-2f91

Characterisation of thermal and thermoelectric properties of porous silicon thin films

Sobhan Erfantalab

Research output: Thesis › Doctoral Thesis

205 Downloads (Pure)

Abstract

The study is centered on investigating the thermal conductivity, specific heat capacity, and Seebeck coefficient of nanostructured porous silicon thin films. The 3ω method was employed to determine the thermal conductivity and specific heat capacity of both supported and suspended films. Meanwhile, the Seebeck coefficient of passivated porous silicon films was characterized using an electrically isolated voltage microprobe and AC heating. This research offers valuable insights for the design and optimization of thermal sensors using porous silicon material technology.

Original language	English
Qualification	Doctor of Philosophy
Awarding Institution	The University of Western Australia
Supervisors/Advisors	Keating, Adrian, Supervisor Dell, John, Supervisor Parish, Gia, Supervisor
Thesis sponsors	Australian Government Research Training Program
Award date	24 Oct 2023
DOIs	https://doi.org/10.26182/qtxb-2f91
Publication status	Unpublished - 2023

Access to Document

10.26182/qtxb-2f91

THESIS - DOCTOR OF PHILOSOPHY - ERFANTALAB Sobhan - 2023
This work is protected by Copyright. You may print or download ONE copy of this document for the purpose of your own non-commercial research or study. Any other use requires permission from the copyright owner. The Copyright Act requires you to attribute any copyright works you quote or paraphrase.

2 Article

Thermal analysis of surface micromachined porous silicon membranes using the 3ω method: Implications for thermal sensing
Erfantalab, S., Sharma, P., Parish, G. & Keating, A., 5 Mar 2023, In: Applied Thermal Engineering. 222, 119965.
Research output: Contribution to journal › Article › peer-review
10 Citations (Scopus)
Determination of thermal conductivity, thermal diffusivity and specific heat capacity of porous silicon thin films using the 3ω method
Erfantalab, S., Parish, G. & Keating, A., Mar 2022, In: International Journal of Heat and Mass Transfer. 184, 122346.
Research output: Contribution to journal › Article › peer-review

Open Access
File
18 Citations (Scopus)

93 Downloads (Pure)

Cite this

@phdthesis{617bb8ebaabf4fed8ac1aefd9cf24794,

title = "Characterisation of thermal and thermoelectric properties of porous silicon thin films",

abstract = "The study is centered on investigating the thermal conductivity, specific heat capacity, and Seebeck coefficient of nanostructured porous silicon thin films. The 3ω method was employed to determine the thermal conductivity and specific heat capacity of both supported and suspended films. Meanwhile, the Seebeck coefficient of passivated porous silicon films was characterized using an electrically isolated voltage microprobe and AC heating. This research offers valuable insights for the design and optimization of thermal sensors using porous silicon material technology.",

keywords = "Porous silicon, Thermal properties, 3ω method, Thermoelectric properties, Thermal conductivity, Heat capacity, Seebeck coefficient, Surface micromachining",

author = "Sobhan Erfantalab",

year = "2023",

doi = "10.26182/qtxb-2f91",

language = "English",

school = "The University of Western Australia",

}

TY - BOOK

T1 - Characterisation of thermal and thermoelectric properties of porous silicon thin films

AU - Erfantalab, Sobhan

PY - 2023

Y1 - 2023

N2 - The study is centered on investigating the thermal conductivity, specific heat capacity, and Seebeck coefficient of nanostructured porous silicon thin films. The 3ω method was employed to determine the thermal conductivity and specific heat capacity of both supported and suspended films. Meanwhile, the Seebeck coefficient of passivated porous silicon films was characterized using an electrically isolated voltage microprobe and AC heating. This research offers valuable insights for the design and optimization of thermal sensors using porous silicon material technology.

AB - The study is centered on investigating the thermal conductivity, specific heat capacity, and Seebeck coefficient of nanostructured porous silicon thin films. The 3ω method was employed to determine the thermal conductivity and specific heat capacity of both supported and suspended films. Meanwhile, the Seebeck coefficient of passivated porous silicon films was characterized using an electrically isolated voltage microprobe and AC heating. This research offers valuable insights for the design and optimization of thermal sensors using porous silicon material technology.

KW - Porous silicon

KW - Thermal properties

KW - 3ω method

KW - Thermoelectric properties

KW - Thermal conductivity

KW - Heat capacity

KW - Seebeck coefficient

KW - Surface micromachining

U2 - 10.26182/qtxb-2f91

DO - 10.26182/qtxb-2f91

M3 - Doctoral Thesis

ER -

Characterisation of thermal and thermoelectric properties of porous silicon thin films

Abstract

Access to Document

Fingerprint

Research output

Thermal analysis of surface micromachined porous silicon membranes using the 3ω method: Implications for thermal sensing

Determination of thermal conductivity, thermal diffusivity and specific heat capacity of porous silicon thin films using the 3ω method

Cite this