TY - JOUR
T1 - A novel nano-porous aluminum substrate with anodizing treatment to encapsulate 1-tetrapropanol as composite phase change materials for thermal energy utilization
AU - Cheng, Fei
AU - Chen, Guo
AU - Lv, Zhenfei
AU - Yang, Chen
AU - Huang, Zhaohui
AU - Fang, Minghao
AU - Liu, Yan'gai
AU - Wu, Xiaowen
AU - Min, Xin
PY - 2021/1/15
Y1 - 2021/1/15
N2 - In this study, an innovative matrix material has been designed and prepared for supporting phase change materials (PCMs) to optimize the thermal property of composite PCM. The abandoned thin-slice aluminum substrate (TS-AS) is etched electrochemically into porous layer with peak-valley structure via anodizing surface treatment, nano-porous Al2O3 film growing on the TS-AS surface is used to encapsulate 1-tetrapropanol (1-TD) to prepare nano-porous TS-AS/1-TD composite PCM. According to thermal properties test results, the melting temperature and phase change latent heat (PCHL) of TS-AS/1-TD composite are 36.9 °C and 97.4 J/g, and its thermal conductivity is enhanced by 560.0% compared to pure 1-TD by introducing porous TS-AS, both these thermal properties show excellent sustainability maintaining only ±1.4% variation even after 400 times melting/freezing thermal cycles, while the composite PCM performs good thermal stability beyond 144.7 °C, which enables them to behave as thermal energy absorbing materials applied to cooling the generated heat from running precision device. Besides, the anodizing mechanism inspires the further optimization of aluminum substrate or other metal substrates by regulating porous layer morphology and thickness.
AB - In this study, an innovative matrix material has been designed and prepared for supporting phase change materials (PCMs) to optimize the thermal property of composite PCM. The abandoned thin-slice aluminum substrate (TS-AS) is etched electrochemically into porous layer with peak-valley structure via anodizing surface treatment, nano-porous Al2O3 film growing on the TS-AS surface is used to encapsulate 1-tetrapropanol (1-TD) to prepare nano-porous TS-AS/1-TD composite PCM. According to thermal properties test results, the melting temperature and phase change latent heat (PCHL) of TS-AS/1-TD composite are 36.9 °C and 97.4 J/g, and its thermal conductivity is enhanced by 560.0% compared to pure 1-TD by introducing porous TS-AS, both these thermal properties show excellent sustainability maintaining only ±1.4% variation even after 400 times melting/freezing thermal cycles, while the composite PCM performs good thermal stability beyond 144.7 °C, which enables them to behave as thermal energy absorbing materials applied to cooling the generated heat from running precision device. Besides, the anodizing mechanism inspires the further optimization of aluminum substrate or other metal substrates by regulating porous layer morphology and thickness.
KW - Aluminum substrate
KW - Anodizing surface treatment
KW - Cooling materials
KW - Nano-porous film
KW - Thermal conductivity enhancement
UR - http://www.scopus.com/inward/record.url?scp=85088983160&partnerID=8YFLogxK
U2 - 10.1016/j.cej.2020.124588
DO - 10.1016/j.cej.2020.124588
M3 - Article
AN - SCOPUS:85088983160
SN - 1385-8947
VL - 404
JO - Chemical Engineering Journal
JF - Chemical Engineering Journal
M1 - 124588
ER -