TY - JOUR
T1 - A lamp thermoelectricity based integrated bake/chill system for photoresist processing
AU - Tay, A.
AU - Chua, Hui
AU - Wu, X.
PY - 2007
Y1 - 2007
N2 - The design of an integrated bake/chill module for photoresist processing in microlithography is presented, with an emphasis on the substrate spatial and temporal temperature uniformity. The system consists of multiple radiant heating zones for heating the substrate, coupled with an array of thermoelectric devices which provide real-time dynamic and spatial control of the substrate temperature. The integration of the bake and chill steps eliminates the loss of temperature control encountered during the mechanical transfer from the bake to chill step. The feasibility of the proposed approach is demonstrated via detailed modeling and simulations based on first principle heat transfer analysis. (c) 2006 Elsevier Ltd. All rights reserved.
AB - The design of an integrated bake/chill module for photoresist processing in microlithography is presented, with an emphasis on the substrate spatial and temporal temperature uniformity. The system consists of multiple radiant heating zones for heating the substrate, coupled with an array of thermoelectric devices which provide real-time dynamic and spatial control of the substrate temperature. The integration of the bake and chill steps eliminates the loss of temperature control encountered during the mechanical transfer from the bake to chill step. The feasibility of the proposed approach is demonstrated via detailed modeling and simulations based on first principle heat transfer analysis. (c) 2006 Elsevier Ltd. All rights reserved.
U2 - 10.1016/j.ijheatmasstransfer.2006.07.016
DO - 10.1016/j.ijheatmasstransfer.2006.07.016
M3 - Article
SN - 0017-9310
VL - 50
SP - 580
EP - 594
JO - International Journal of Heat and Mass Transfer
JF - International Journal of Heat and Mass Transfer
ER -