A fusion prognostics-based qualification test methodology for microelectronic products

Michael Pecht, Tadahiro Shibutani, Myeongsu Kang, Melinda Hodkiewicz, Edward Cripps

Research output: Contribution to journalReview article

9 Citations (Scopus)

Abstract

The global market for microelectronic products is projected to reach US$2.4 trillion per year by 2020. This growth has led to intense competition between manufacturers to minimize the time-to-market for their products. Unfortunately, however, qualification testing, which is time-consuming and resource-intensive, is a major bottleneck for the quick release of microelectronic products to the market. Hence, for both researchers and engineers considering the time with reliability issues during qualification testing, this paper provides a review of conventional methodologies in qualification testing and presents a fusion prognostics-based qualification test methodology that combines the advantages of physics-of-failure and data-driven methods.

Original languageEnglish
Pages (from-to)320-324
Number of pages5
JournalMicroelectronics Reliability
Volume63
DOIs
Publication statusPublished - 1 Aug 2016

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