4D-printing of mechanically durable high-temperature shape memory polymer with good irradiation resistance

Bato Ch Kholkhoev, Kseniia N. Bardakova, Alena N. Nikishina, Zakhar A. Matveev, Yuri M. Efremov, Anastasia A. Frolova, Anastasiya A. Akovantseva, Elena N. Gorenskaia, Nikolay A. Verlov, Peter S. Timashev, Vitalii F. Burdukovskii

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

4D-printed shape memory polymers (SMPs) are of great interest in the aerospace industry. However, development of high-temperature SMPs that combine high mechanical characteristics and radiation resistance remains challenging. Here, we report a new photosensitive composition (PSC) based on high-performance thermally stable poly-N,N'-(m-phenylene)isophthalamide (MPA), rigid photopolymerizable tris[2-(acryloyloxy)ethyl] isocyanurate (TAI), and a reactive solvent (N,N-dimethylacrylamide (DMAA)). The resulting PSC was utilized to prepare high-temperature SMPs using a facile two-step LCD 3D-printing and thermal post-curing process. The synergy effect between rigid backbones of MPA and TAI results in the highest reported tensile strength (104.4 ± 6.2 MPa) and glass transition temperature (180°C) of 4D-printed SMPs. The presence of soft segments from DMAA results in a good shape memory performance (shape fixity and shape recovery ratios both exceed 99%). Furthermore, this is the first comprehensive study of the influence of ionizing radiation on the performance characteristics of 4D-printed materials. It was shown that a 4D-printed SMP has endured γ-radiation with doses up to 10^6 Gy with the chemical structure, glass transition temperature, thermal stability, and shape memory behavior remaining virtually unchanged. In addition, MPA-based materials keep high tensile strengths (> 100 MPa) and elongations at break (> 5%) after being irradiated. With the high glass transition temperature, record-high tensile strength, excellent irradiation resistance, and 4D-printability, this new high temperature SMP shows great potential in deployable space structures application.

Original languageEnglish
Article number102022
JournalApplied Materials Today
Volume36
Early online date12 Dec 2023
DOIs
Publication statusPublished - Feb 2024

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