TY - JOUR
T1 - 4D-printing of mechanically durable high-temperature shape memory polymer with good irradiation resistance
AU - Kholkhoev, Bato Ch
AU - Bardakova, Kseniia N.
AU - Nikishina, Alena N.
AU - Matveev, Zakhar A.
AU - Efremov, Yuri M.
AU - Frolova, Anastasia A.
AU - Akovantseva, Anastasiya A.
AU - Gorenskaia, Elena N.
AU - Verlov, Nikolay A.
AU - Timashev, Peter S.
AU - Burdukovskii, Vitalii F.
PY - 2024/2
Y1 - 2024/2
N2 - 4D-printed shape memory polymers (SMPs) are of great interest in the aerospace industry. However, development of high-temperature SMPs that combine high mechanical characteristics and radiation resistance remains challenging. Here, we report a new photosensitive composition (PSC) based on high-performance thermally stable poly-N,N'-(m-phenylene)isophthalamide (MPA), rigid photopolymerizable tris[2-(acryloyloxy)ethyl] isocyanurate (TAI), and a reactive solvent (N,N-dimethylacrylamide (DMAA)). The resulting PSC was utilized to prepare high-temperature SMPs using a facile two-step LCD 3D-printing and thermal post-curing process. The synergy effect between rigid backbones of MPA and TAI results in the highest reported tensile strength (104.4 ± 6.2 MPa) and glass transition temperature (180°C) of 4D-printed SMPs. The presence of soft segments from DMAA results in a good shape memory performance (shape fixity and shape recovery ratios both exceed 99%). Furthermore, this is the first comprehensive study of the influence of ionizing radiation on the performance characteristics of 4D-printed materials. It was shown that a 4D-printed SMP has endured γ-radiation with doses up to 10^6 Gy with the chemical structure, glass transition temperature, thermal stability, and shape memory behavior remaining virtually unchanged. In addition, MPA-based materials keep high tensile strengths (> 100 MPa) and elongations at break (> 5%) after being irradiated. With the high glass transition temperature, record-high tensile strength, excellent irradiation resistance, and 4D-printability, this new high temperature SMP shows great potential in deployable space structures application.
AB - 4D-printed shape memory polymers (SMPs) are of great interest in the aerospace industry. However, development of high-temperature SMPs that combine high mechanical characteristics and radiation resistance remains challenging. Here, we report a new photosensitive composition (PSC) based on high-performance thermally stable poly-N,N'-(m-phenylene)isophthalamide (MPA), rigid photopolymerizable tris[2-(acryloyloxy)ethyl] isocyanurate (TAI), and a reactive solvent (N,N-dimethylacrylamide (DMAA)). The resulting PSC was utilized to prepare high-temperature SMPs using a facile two-step LCD 3D-printing and thermal post-curing process. The synergy effect between rigid backbones of MPA and TAI results in the highest reported tensile strength (104.4 ± 6.2 MPa) and glass transition temperature (180°C) of 4D-printed SMPs. The presence of soft segments from DMAA results in a good shape memory performance (shape fixity and shape recovery ratios both exceed 99%). Furthermore, this is the first comprehensive study of the influence of ionizing radiation on the performance characteristics of 4D-printed materials. It was shown that a 4D-printed SMP has endured γ-radiation with doses up to 10^6 Gy with the chemical structure, glass transition temperature, thermal stability, and shape memory behavior remaining virtually unchanged. In addition, MPA-based materials keep high tensile strengths (> 100 MPa) and elongations at break (> 5%) after being irradiated. With the high glass transition temperature, record-high tensile strength, excellent irradiation resistance, and 4D-printability, this new high temperature SMP shows great potential in deployable space structures application.
KW - aromatic polyamide
KW - LCD 4D-printing
KW - shape memory polymers
KW - smart materials
KW - γ-radiation
UR - http://www.scopus.com/inward/record.url?scp=85179583468&partnerID=8YFLogxK
U2 - 10.1016/j.apmt.2023.102022
DO - 10.1016/j.apmt.2023.102022
M3 - Article
AN - SCOPUS:85179583468
SN - 2352-9407
VL - 36
JO - Applied Materials Today
JF - Applied Materials Today
M1 - 102022
ER -